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Liquid Epoxy Resin

Solid Epoxy Resin

Polyamide Epoxy Resin

Epoxy Floor Hardener

Novolac Epoxy Resin

Hydrogenated Bisphenol A Epoxy Resin

Phenalkamine Epoxy Hardener

Cycloaliphatic Amine Hardener

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Epoxy Curing Accelerator

Epoxy Resin Adhesive
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pertanyaan umum
Produk

Liquid Epoxy Resin

Solid Epoxy Resin

Polyamide Epoxy Resin

Epoxy Floor Hardener

Novolac Epoxy Resin

Hydrogenated Bisphenol A Epoxy Resin

Phenalkamine Epoxy Hardener

Cycloaliphatic Amine Hardener

Epoxy Resin Additives

Epoxy Curing Accelerator

Epoxy Resin Adhesive
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products details

Created with Pixso. Beranda Created with Pixso. Produk Created with Pixso.
Polyamide Epoxy Resin
Created with Pixso. Polyetheramine Hot Melt Electronic Adhesive Glue Sealing Curing Agent D-230
Polyetheramine Hot Melt Electronic Adhesive Glue Sealing Curing Agent D-230
  • name

Polyetheramine Hot Melt Electronic Adhesive Glue Sealing Curing Agent D-230

Brand Name: HONREPOXY
Model Number: D230
MOQ: 5ton
Price: USD4.4-5.3/kg
Detail Information
Product Description
Detail Information
Tempat asal:
Cina
Bahan:
Polietheramine
Penampilan:
Cairan Transparan Ringan
Nilai Amina (mgKOH/g):
440~480
AHEW (Amina hidrogen setara berat),g/eq:
40
Kemasan rincian:
200kg dalam drum besi
Menyediakan kemampuan:
3000 ton per bulan
Menyoroti:

Polyetheramine electronic adhesive glue

,

Hot Melt electronic adhesive glue

,

D-230 adhesive glue for electronics

Product Description
Polyamide hot melt adhesive electronic sealing glue curing agent D-230 countertype C301 D-230 is characterized by repeating oxypropylene units in the backbone. It is a difunctional, primary amine with an average molecular weight of about 230. 1.The physical and chemical properties Color, Pt-Co
Tags: 

Liquid Low Viscosity Epoxy Resin  

Transparent Epoxy Hardener Resin  

Cost-Effective Polyamide Epoxy Resin

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